Abstract: This paper presents development of antenna-on-package devices using TI's 77GHz and 60GHz mm-wave radar chips. Two test devices, based on two configurations of flip-chip packaging technology, ...
Abstract: High-performance IC-to-antenna interconnection is one of the key enablers for the mass production of high-end millimeter wave (mmW) radar systems above 100 GHz. In this work, a radar system ...
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